Properties of encapsulation materials and their relevance for quality control and recent field failures

By Juliane Berghold and Tsuyoshi Shioda

Module defects: The properties of module encapsulant materials are coming under closer scrutiny as their role in a number of common field failures becomes better understood. Juliane Berghold and Tsuyoshi Shioda report on new testing methods being developed to analyse the composition of encapsulants and improve the quality control of this crucial material.