Plating for passivated-contact solar cells

Published: June 1, 2020

By Sven Kluska, Thibaud Hatt, Benjamin Grübel, Gisela Cimiotti, Christian Schmiga, Varun Arya, Bernd Steinhauser, Frank Feldmann, Jonas Bartsch, Baljeet Singh Goraya, Sebastian Nold, Andreas A. Brand, Jan Nekarda, Markus Glatthaar & Stefan W. Glunz, Fraunhofer Institute for Solar Energy Systems ISE, Freiburg, Germany

Passivated-contact solar cell designs, such as TOPCon or silicon heterojunction solar cells (SHJs), enable cell efficiencies greater than 24%, and are promising candidates for the next revolution in mass production after the passivated emitter and rear cell (PERC). Plated metallization (Ni/Cu/Ag or Cu/Ag) fits well with new constraints on low-temperature processing and the combination of low material costs
and highly conductive bifacial metal grids for these types of solar cell.

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