Photovoltaics International Volume 19

Published: March 1, 2013

For manufacturers who had their heads in the bunker during 2012, fighting falling ASPs and eroding margins, the nineteenth edition brings you details of what lies in store for this coming year. Wright Williams & Kelly return in this issue with their popular analysis of payback on technology buys; crucially they analyze n-type wafers, Al2O3 passivation and copper metallization. SERIS shows us how to achieve 18.7% efficiencies using low-cost etching techniques on diffused wafers. We also have two important technology roundups: CIGS from Helmholtz Berlin, and PV module encapsulation techniques from Fraunhofer ISE.

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