Challenges for the interconnection of crystalline silicon heterojunction solar cells

Published: June 1, 2018

By Angela De Rose; Torsten Geipel; Denis Erath; Achim Kraft; Ulrich Eitner, Fraunhofer Institute for Solar Energy Systems ISE, Freiburg, Germany

Crystalline silicon heterojunction (HJT) solar cells and modules based on amorphous silicon on monocrystalline wafers offer advantages over established wafer-based technologies in terms of efficiency potential, complexity of the manufacturing process, and energy yield of the modules. The temperature sensitivity of these solar cells, however, poses considerable challenges for their integration in modules. Currently, there exist three approaches for the interconnection of HJT solar cells, each with its own strengths and weaknesses: 1) ribbon soldering with low-meltingpoint alloys; 2) gluing of ribbons by using electrically conductive adhesives (ECAs); 3) SmartWire Connection Technology (SWCT).

Single Paper

Includes one paper digital access
US$ 21

Photovoltaics International SubscriptionDigital & Archive

Includes 12 months of unlimited digital access to the Photovoltaics International content, full online archive, technical paper collection (over 700), and more.

Includes 2 upcoming issues in digital.

US$ 449 per year

This Website Uses Cookies

By continuing browsing this website you are accepting our Cookie Policy, as well as our Terms of Use and Privacy Policy.